Comprehensive Educational Resource for High-Temperature Metal Degradation
| Alloy System | Low Cr Content | Increasing Cr | Critical Cr Content | Key Issues | Practical Notes |
|---|---|---|---|---|---|
| Ni–Cr | External NiO + internal Cr₂O₃ islands + NiCr₂O₄ spinel | Spinel islands block Ni diffusion, oxidation rate decreases | ~10 wt% at 1000°C (for continuous Cr₂O₃) | Transient oxidation (NiO/NiCr₂O₄ form first), Cr depletion under scale | For long-term resistance need ≥18–20 wt% Cr |
| Fe–Cr | Fe oxides (FeO, Fe₃O₄, Fe₂O₃), little Cr effect | Spinel FeCr₂O₄ reduces Fe diffusion, lowers oxidation rate somewhat | >20 wt% Cr (but protection imperfect) | Fe can diffuse through Cr₂O₃ → outer Fe oxides form; sigma-phase embrittlement >25% Cr | Stainless steels (e.g., 8Ni–18Cr) resist aqueous corrosion, but not high-temp oxidation |
| Co–Cr | CoO + Cr₂O₃ islands, rapid oxidation | Similar to Ni–Cr but slower Cr diffusion | ~30 wt% Cr | Strong transient oxidation, low diffusion coefficient, need high Cr | Co-base superalloys designed with ~30% Cr for oxidation resistance |
| Alloy System | Oxidation Behavior | Scale Type | Mechanism / Notes | Rate / Effect |
|---|---|---|---|---|
| Fe–Cu | Cu does not oxidize; enriches at metal/scale interface | Cu-rich rim at interface | If T < Cu melting → solid Cu slows Fe diffusion. If T > Cu melting → liquid Cu penetrates grain boundaries → hot shortness | Slower oxidation below melting; risk of cracking above melting |
| Nb–Zr | Zr internally oxidizes under Nb-rich external scale | Nb-rich scale + Zr oxide precipitates | Internal oxidation is diffusion-controlled; external scale grows linearly → paralinear kinetics | Linear scale growth; internal oxidation reaches steady-state penetration |
| Ni–Co | Both NiO and CoO form solid solution scale | Single-phase Ni–Co oxide | Co ions diffuse faster due to higher cation vacancy concentration + lower activation energy → Co enriches near scale–gas interface | Faster oxidation than pure Ni; scale growth enhanced by Co diffusion |
| Ni–Cr | Low Cr → internal Cr oxidation (Cr₂O₃ islands) in NiO matrix. High Cr → continuous Cr₂O₃ layer | Duplex NiO + NiCr₂O₄ islands → Cr₂O₃ at high Cr | Transient oxidation: Ni-rich oxides form first; Cr₂O₃ becomes continuous at critical Cr content (~10 wt% Ni alloys) | Parabolic rate; rate decreases as Cr content increases |
| Fe–Cr | Low Cr → external Fe/Cr oxides; high Cr → Cr₂O₃ layer | Fe-rich outer + mixed spinel (Fe,Cr) inner | Fe ions more mobile than Cr³⁺; Cr₂O₃ protective only above critical Cr (~20 wt%) | Oxidation rate decreases with Cr; below critical Cr, Fe oxides dominate |
| Co–Cr | Similar to Ni–Cr; higher Cr needed | Cr₂O₃ external | Critical Cr higher (~30 wt%) due to low interdiffusion and rapid transient oxidation | Slower oxidation with sufficient Cr; Cr₂O₃ protects alloy |
| Aspect | Observation / Behavior | Examples / Notes |
|---|---|---|
| Selective Oxidation | Same principles as in alloys apply; quantitative differences exist. | Depends on thermodynamic stability of oxides. |
| Oxygen Solubility | Most intermetallics have negligible O solubility → internal oxidation is rare. | Exceptions: Ti₃Al, Ni₃Al dissolve significant O. |
| Compound Stoichiometry | Narrow composition ranges → oxidation of one element can produce a lower compound beneath oxide. | e.g., NbAl₃ → Al₂O₃ forms on surface, depletion forms Nb₂Al → alumina breaks down → layered oxide forms. |
| Relative Oxide Stability | Selective oxidation requires protective oxide (Al₂O₃ or SiO₂) to be more stable than base-metal oxides. | Ni aluminides, Mo silicides: protective oxide forms. Ti-Al or Nb-Al with less Al → intermixed oxides (Al₂O₃ + TiO₂), no selective oxidation. |
| Oxide Morphology | Often complex; layered scales can form; inward O transport + outward metal transport. | Ti₃Al after 165 h at 900°C: α-Al₂O₃ + TiO₂ mixture, discrete alumina crystals on top, TiO₂ layer at surface. |
| Transient Oxides & Temperature Effects | Transient oxides can hinder protective layer formation at low T; at high T, volatile oxides evaporate, allowing continuous layer formation. | MoSi₂: above 600°C → slow oxidation (continuous silica layer); 500°C → mixed SiO₂ + MoO₃ layer, faster oxidation; similar for TaSi₂, NbSi₂. |
| Fabrication Effects | Oxidation rates depend on form: single crystal, polycrystal, HIP processing. | Figure 5.29: MoSi₂ oxidation varies with cast, single crystal, and HIP at different temperatures. |
| Failure Modes | Layered or intermixed scales → inward O → embrittlement; polycrystalline materials may "pest" due to grain-boundary oxidation. | NbSi₂, TaSi₂ prone to accelerated oxidation above 1000°C if transient oxides non-volatile. |